Mechanical properties of biomorphous ceramics

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dc.contributor.authorKiselov, V.S.
dc.contributor.authorBorisov, Yu.S.
dc.contributor.authorTryus, M.
dc.contributor.authorVitusevich, S.A
dc.contributor.authorPud, S.
dc.contributor.authorBelyaev, A.E.
dc.date.accessioned2017-05-31T05:26:55Z
dc.date.available2017-05-31T05:26:55Z
dc.date.issued2012
dc.description.abstractMechanical properties: The Vickers hardness and bending strength of porous biomorphic SiC (bioSiC) ceramics fabricated from different natural hardwoods were investigated. It has been found that these parameters are highly dependent on the geometrical densities of ceramics, and Vickers hardness values can be well described using the Ryskevitch-type equation. It has been shown that the data of geometrical density bio-SiC ceramics can be used to estimate mechanical parameters such as bending strength. Materials with advanced properties appropriate for surgical applications are being designed. Further ways to improve the mechanical properties of ceramics and ceramic products have been discusseduk_UA
dc.description.sponsorshipTeam from ISP acknowledges financial support from Ukrainian State Program “Nanotechnology and nanomaterials”. S. Pud would like to acknowledge the DAAD Foundation for financial support.uk_UA
dc.identifier.citationMechanical properties of biomorphous ceramics / V.S. Kiselov, Yu.S.Borisov, M.Tryus, S.A Vitusevich, S.Pud and A.E. Belyaev // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2012. — Т. 15, № 4. — С. 386-392. — Бібліогр.: 22 назв. — англ.uk_UA
dc.identifier.issn1560-8034
dc.identifier.otherPACS 81.05.Je, 81.05.Mn
dc.identifier.urihttps://nasplib.isofts.kiev.ua/handle/123456789/118732
dc.language.isoenuk_UA
dc.publisherІнститут фізики напівпровідників імені В.Є. Лашкарьова НАН Україниuk_UA
dc.relation.ispartofSemiconductor Physics Quantum Electronics & Optoelectronics
dc.statuspublished earlieruk_UA
dc.titleMechanical properties of biomorphous ceramicsuk_UA
dc.typeArticleuk_UA

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Semicond. Physics Quantum Electronics & Optoelectronics, 2012, № 4