Effect of rapid thermal annealing on properties of contacts Au-Mo-TiBx-GaAs

dc.contributor.authorVenger, E.F.
dc.contributor.authorBeliaev, A.A.
dc.contributor.authorBoltovets, N.S.
dc.contributor.authorErmolovich, I.B.
dc.contributor.authorIvanov, V.N.
dc.contributor.authorKonakova, R.V.
dc.contributor.authorMilenin, V.V.
dc.contributor.authorVoitsikhovski, D.I.
dc.contributor.authorFigielski, T.
dc.contributor.authorMakosa, A.
dc.date.accessioned2017-06-10T08:01:34Z
dc.date.available2017-06-10T08:01:34Z
dc.date.issued1999
dc.description.abstractThe analytical, structural and electrophysical techniques have been applied to studies of the thermal degradation mechanism appearing in diode structures with the Schottky barrier Au-Mo-TiBxGaAs. It was shown that the rapid thermal annealing at T = 600 °C during 60 sec in hydrogen atmosphere results in creating the ELS type center in the space charge region of GaAs. This center is represented by the complex VGa+VAs, which has been confirmed by photoluminescence measurements. It causes the appearance of excess current at the initial part of current-voltage characteristic.uk_UA
dc.description.sponsorshipThe work is supported by STCU, project 464.uk_UA
dc.identifier.citationEffect of rapid thermal annealing on properties of contacts Au-Mo-TiBx-GaAs / E.F. Venger, A.A. Beliaev, N.S. Boltovets, I.B. Ermolovich, V.N. Ivanov, R.V. Konakova, V.V. Milenin, D.I.Voitsikhovski, T. Figielski, A. Makosa // Semiconductor Physics Quantum Electronics & Optoelectronics. — 1999. — Т. 2, № 3. — С. 57-61. — Бібліогр.: 7 назв. — англ.uk_UA
dc.identifier.issn1560-8034
dc.identifier.otherPACS: 73.30; 85.30.H, K
dc.identifier.urihttps://nasplib.isofts.kiev.ua/handle/123456789/119864
dc.language.isoenuk_UA
dc.publisherІнститут фізики напівпровідників імені В.Є. Лашкарьова НАН Україниuk_UA
dc.relation.ispartofSemiconductor Physics Quantum Electronics & Optoelectronics
dc.statuspublished earlieruk_UA
dc.titleEffect of rapid thermal annealing on properties of contacts Au-Mo-TiBx-GaAsuk_UA
dc.typeArticleuk_UA

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