Metallic films for triggering vacuum-arc plasma sources
| dc.contributor.author | Sysoiev, Yu.A. | |
| dc.date.accessioned | 2017-06-12T06:45:23Z | |
| dc.date.available | 2017-06-12T06:45:23Z | |
| dc.date.issued | 2014 | |
| dc.description.abstract | Results of the studies on forming the conductive film in discharge gap of the trigger injector during the operation of vacuum-arc plasma source are presented. The film was deposited on the end of ceramic tube surface used for filling the discharge gap trigger injectors. Experiments were performed in the practicable conditions for technological processes of protective and decorating coating in the plasma sources with magnetic confinement of the cathode spot and chromium and titanium cathodes. It was revealed the cathode materials and conditions of the coatings deposition influence on structure and properties of the films obtained on ceramics Al₂O₃-SiO₂-BaO₂. The rate of the film growth was defined, its variation is in the range of 1.1-3.3 nm/s. | uk_UA |
| dc.identifier.citation | Metallic films for triggering vacuum-arc plasma sources / Yu.A. Sysoiev // Functional Materials. — 2014. — Т. 21, № 1. — С. 47-51. — Бібліогр.: 10 назв. — англ. | uk_UA |
| dc.identifier.issn | 1027-5495 | |
| dc.identifier.other | DOI: dx.doi.org/10.15407/fm21.01.047 | |
| dc.identifier.uri | https://nasplib.isofts.kiev.ua/handle/123456789/120391 | |
| dc.language.iso | en | uk_UA |
| dc.publisher | НТК «Інститут монокристалів» НАН України | uk_UA |
| dc.relation.ispartof | Functional Materials | |
| dc.status | published earlier | uk_UA |
| dc.subject | Characterization and properties | uk_UA |
| dc.title | Metallic films for triggering vacuum-arc plasma sources | uk_UA |
| dc.type | Article | uk_UA |
Файли
Оригінальний контейнер
1 - 1 з 1
Завантаження...
- Назва:
- 09-Sysoiev.pdf
- Розмір:
- 1.43 MB
- Формат:
- Adobe Portable Document Format
- Опис:
- Стаття
Контейнер ліцензії
1 - 1 з 1
Завантаження...
- Назва:
- license.txt
- Розмір:
- 817 B
- Формат:
- Item-specific license agreed upon to submission
- Опис: