Исследование процесса монтажа кристаллов мощных транзисторов вибрационной пайкой

Abstract

Автомат ЭМ4085-14М позволяет осуществлять качественный монтаж на припой кристаллов мощных высоковольтных транзисторов с площадью 25 мм².The process of automated chip maunting power high-voltage transistors by vibration soldering on EM4085-14M placer has been researched. The factors determinating heating temperature and magnitudes of resibual stresses in chips: thickness of soldered connection, continuous layer of solder under chip, retentivity of chip on adgesion carrier have been determinated. The solder thickness dependences under chip on magnitude of solder doze as well as on the failure amount of the vibration amplitude have been researched.