Dislocation-diffusion mechanism of high-temperature healing of the cracks in crystals under loading

Abstract

The regularities of disc-like voids (cracks) healing in polycrystalline copper samples under conditions of uniaxial compression at 600°C were experimentally studied. The theory of crack healing by diffusion-dislocation mechanism was developed. Comparing the experimental data with the theoretical dependences has shown their complete correspondence, which is supported by agreement of the experimental Peierls threshold stress with literature data. The work is an important step for solving the general problem on mechanisms of stress relaxation near various stress concentrators in crystals.